Preparations continue and expectation is mounting around the “VI International Congress on Architectural Envelopes (ICAE)”, which will be held at the Conference Hall and Kursaal Auditorium in Donostia-San Sebastián (Spain), on the 20, 21 and 22 June 2012.
The event will centre on innovation in the field of architectural envelopes. As in the five earlier congress events, the ICAE will provide a forum for active participation within the sector. A business opportunity to think about, to get to know, and to take advantage of the innovations offered by the various participants that are involved.


